Cu Film Characteristics Synthesized Using Electrodeposition Technique at Various Currents and Under a Rotating Neodymium Magnet
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Keywords:
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Cu Films, Electrodeposition, Magnetic Field, Corrosion, Inhibition, Antibacterial Activity
Abstract
In the present study, Cu films were made over Al alloy using the electrodeposition technique. Electrodeposition conducted at various currents (80, 100, and 120 mA), with and without influence by a rotating magnetic field (100 rpm of rotation). 0.5 M CuSO4 + 20 mL of H2SO4 was used for electrolyte solutions. The sample before and after electrodeposition was weighed using digital scale to calculate deposition rate and current efficiency. All formed Cu films were characterized using X-ray diffraction (XRD), attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR), Scanning electron microscopy equipped with Energy dispersive spectroscopy (SEM-EDS), and Potentiostat apparatus. Furthermore, antibacterial activity using Staphylococcus aureus was also investigated. Increasing the current of electrodeposition leads to an increase in deposition rate and current efficiency for both conditions (with and without rotating magnetic field influence). Based on the XRD and ATR-FTIR investigation, Cu was successfully deposited onto Al surface. Currents used for the electrodeposition process between 80-100 mA would result in a faceted structure, while using 120 mA results near to spheroidal. Shifting to higher currents leads to decreases in grain sizes and presenting a rotating magnetic field also enhances the grain size. Current and rotating magnetic influences are not linearly influencing corrosion potential, corrosion rate and antibacterial activity. The sample made using higher current plus influencing with a rotating magnetic field has less corrosion rate and higher area of inhibition at around 0.808 mmpy and 4.01 cm2.
References
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Arendsen, L. P., R. Thakar, and A. H. Sultan (2019). The Use of Copper as an Antimicrobial Agent in Health Care, Including Obstetrics and Gynecology. Clinical Microbiology Reviews, 32(4); 1–28.
Armini, S. (2011). Cu Electrodeposition on Resistive Substrates in Alkaline Chemistry: Effect of Current Density and Wafer RPM. Journal of The Electrochemical Society, 158(6); D390–D394.
Augustin, A., P. Huilgol, K. R. Udupa, and K. U. Bhat (2016a). Effect of Current Density During Electrodeposition on Microstructure and Hardness of Textured Cu Coating in the Application of Antimicrobial Al Touch Surface. Journal of the Mechanical Behavior of Biomedical Materials, 63; 352–360.
Augustin, A., K. R. Udupa, and K. U. Bhat (2016b). Effect of Coating Current Density on the Wettability of Electrodeposited Copper Thin Film on Aluminum Substrate. Perspectives in Science, 8; 472–474.
Chiba, A., T. Ogawa, and T. Yamashita (1988). Magnetic Field Effects on the Electrodeposition of Copper from Copper Sulphate in Sulphuric Acid. Surface and Coatings Technology, 34(4); 455–462.
Ekthammathat, N., T. Thongtem, and S. Thongtem (2013). Antimicrobial Activities of CuO Films Deposited on Cu Foils by Solution Chemistry. Applied Surface Science, 277; 211–217.
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Fatoni, A., A. Rendowati, L. Sirumapea, L. Miranti, S. Masitoh, and N. Hidayati (2023). Synthesis, Characterization of Chitosan-ZnO/CuO Nanoparticles Film, and Its Effect as an Antibacterial Agent of Escherichia coli. Science and Technology Indonesia, 8(3); 373–381.
Fuku, X., M. Modibedi, and M. Mathe (2020). Green Synthesis of Cu/Cu₂O/CuO Nanostructures and the Analysis of Their Electrochemical Properties. SN Applied Sciences, 2(5); 1–15.
Fukunaka, Y., H. Doi, and Y. Kondo (1990). Structural Variation of Electrodeposited Copper Film with the Addition of an Excess Amount of H₂SO₄. Journal of The Electrochemical Society, 137(1); 88–93.
Gilbertson, L. M., E. M. Albalghiti, Z. S. Fishman, F. Perreault, C. Corredor, J. D. Posner, M. Elimelech, L. D. Pfefferle, and J. B. Zimmerman (2016). Shape-Dependent Surface Reactivity and Antimicrobial Activity of Nano-Cupric Oxide. Environmental Science and Technology, 50(7); 3975–3984.
Goranova, D., R. Rashkov, G. Avdeev, and V. Tonchev (2016). Electrodeposition of Ni–Cu Alloys at High Current Densities: Details of the Elements Distribution. Journal of Materials Science, 51(18); 8663–8673.
Grujicic, D. and B. Pesic (2002). Electrodeposition of Copper: The Nucleation Mechanisms. Electrochimica Acta, 47(18); 2901–2912.
Haerifar, M. and M. Zandrahimi (2013). Effect of Current Density and Electrolyte pH on Microstructure of Mn–Cu Electroplated Coatings. Applied Surface Science, 284; 126–132.
Hsu, J., M. S. E. Houache, Y. Abu-Lebdeh, R. A. Patton, M. I. Guzman, and H. A. Al-Abadleh (2024). In Situ Electrochemistry of Formate on Cu Thin Films Using ATR-FTIR Spectroscopy and X-ray Photoelectron Spectroscopy. Langmuir, 40(4); 2377–2384.
Ibañez, A. and E. Fatás (2005). Mechanical and Structural Properties of Electrodeposited Copper and Their Relation with the Electrodeposition Parameters. Surface and Coatings Technology, 191(1); 7–16.
Ji, R., K. Han, H. Jin, X. Li, Y. Liu, S. Liu, T. Dong, B. Cai, and W. Cheng (2020). Preparation of Ni–SiC Nano-Composite Coating by Rotating Magnetic Field-Assisted Electrodeposition. Journal of Manufacturing Processes, 57; 787–797.
Kamila, E. A., Z. Abidin, I. I. Arief, and Trivadila (2023). Synthesis, Characterization, Antibacterial Activity, and Potential Water Filter Application of Copper Oxide/Zeolite Composite. Makara Journal of Science, 27(3); 186–193.
Kayani, Z. N., M. Ashfaq, S. Riaz, and S. Naseem (2022). Impact of Cu on Structural, Optical, Dielectric Properties and Antibacterial Activity of TiO₂ Thin Films. Optical Materials, 132; 112809.
Kong, Q., A. Zeng, M. Chen, M. Zhou, and Q. Xu (2003). Infrared Spectra and Density Functional Calculations of the Copper Thiocarbonyls: CuCS, Cu(CS)₂, and Cu₂CS in Solid Argon. Journal of Chemical Physics, 118(16); 7267–7272.
Larson, A. C. and R. B. V. Dreele (2004). General Structure Analysis System (GSAS). Technical Report Vol. 748, Los Alamos.
Li, W., L. Hu, S. Zhang, and B. Hou (2011). Effects of Two Fungicides on the Corrosion Resistance of Copper in 3.5% NaCl Solution Under Various Conditions. Corrosion Science, 53(2); 735–745.
Li, Z., B. Tan, J. Luo, J. Qin, G. Yang, C. Cui, and L. Pan (2022). Structural Influence of Nitrogen-Containing Groups on Triphenylmethane-Based Levelers in Super-Conformal Copper Electroplating. Electrochimica Acta, 401; 139445.
Liu, Y., B. Zheng, T. Zhang, Y. Chen, J. Liu, Z. Wang, and X. Gong (2022). Magnetic Field Intensified Electrodeposition of Low-Concentration Copper Ions in Aqueous Solution. Electrochimica Acta, 432; 141201.
Mogi, I., R. Morimoto, R. Aogaki, and K. Watanabe (2013). Surface Chirality Induced by Rotational Electrodeposition in Magnetic Fields. Scientific Reports, 3; 2574.
Morimoto, R., A. Sugiyama, and R. Aogaki (2004). Nano-Scale Crystal Formation in Copper Magneto-Electrodeposition Under Parallel Magnetic Fields. Electrochemistry, 72(6); 421–423.
Motshekga, S. C. (2024). Structural and Antibacterial Properties of Copper Oxide Nanoparticles: A Study on the Effect of Calcination Temperature. Nano Express, 5(1); 015011.
Murdoch, H. A., D. Yin, E. Hernández-Rivera, and A. K. Giri (2018). Effect of Applied Magnetic Field on Microstructure of Electrodeposited Copper. Electrochemistry Communications, 97; 11–15.
Niu, J., X. Liu, K. Xia, L. Xu, Y. Xu, X. Fang, and W. Lu (2015). Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams. International Journal of Electrochemical Science, 10(9); 7331–7340.
Park, B. N., Y. S. Sohn, and S. Y. Choi (2008). Effects of a Magnetic Field on the Copper Metallization Using the Electroplating Process. Microelectronic Engineering, 85(2); 308–314.
Raja, F. N. S., T. Worthington, and R. A. Martin (2023). The Antimicrobial Efficacy of Copper, Cobalt, Zinc and Silver Nanoparticles: Alone and in Combination. Biomedical Materials (Bristol), 18; 045003.
Ramyadevi, J., K. Jeyasubramanian, A. Marikani, G. Rajakumar, and A. A. Rahuman (2012). Synthesis and Antimicrobial Activity of Copper Nanoparticles. Materials Letters, 71; 114–116.
Salah, I., E. Allan, S. P. Nair, and I. P. Parkin (2024). Antibacterial Performance of a Copper Nanoparticle Thin Film. Nano Select, 5(9); 1–13.
SEAKR, R. (2017). Microstructure and Crystallographic Characteristics of Nanocrystalline Copper Prepared from Acetate Solutions by Electrodeposition Technique. Transactions of Nonferrous Metals Society of China (English Edition), 27(6); 1423–1430.
SEKAR, R. (2017). Synergistic Effect of Additives on Electrodeposition of Copper from Cyanide-Free Electrolytes and Its Structural and Morphological Characteristics. Transactions of Nonferrous Metals Society of China (English Edition), 27(7); 1665–1676.
Selvaraj, S. P. (2020). Enhanced Surface Morphology of Copper Oxide (CuO) Nanoparticles and Its Antibacterial Activities. Materials Today: Proceedings, 50; 2865–2868.
Sen, P., J. Ghosh, A. Abdullah, P. Kumar, and Vandana (2003). Preparation of Cu, Ag, Fe and Al Nanoparticles by the Exploding Wire Technique. Journal of Chemical Sciences, 115; 499–508.
Sharifahmadian, O., H. R. Salimijazi, M. H. Fathi, J. Mostaghimi, and L. Pershin (2013). Relationship Between Surface Properties and Antibacterial Behavior of Wire Arc Spray Copper Coatings. Surface and Coatings Technology, 233; 74–79.
Shim, G. I., S. H. Kim, H. W. Eom, and S. Y. Choi (2015). Concentration and Roughness-Dependent Antibacterial and Antifungal Activities of CuO Thin Films and Their Cu Ion Cytotoxicity and Elution Behavior. Journal of Industrial Microbiology and Biotechnology, 42(5); 735–744.
Sudheer and M. A. Quraishi (2013). Electrochemical and Theoretical Investigation of Triazole Derivatives on Corrosion Inhibition Behavior of Copper in Hydrochloric Acid Medium. Corrosion Science, 70; 161–169.
Syamsuir, R. S. Kusumah, A. Premono, A. Lubi, B. Soegijono, S. D. Yudanto, M. K. Ajiriyanto, S. Ismarwanti, R. Kriswarini, C. Rosyidan, D. Nanto, Basori, and F. B. Susetyo (2024). Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers. E-Journal of Surface Science and Nanotechnology, 22(2); 120–128.
Syamsuir, F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori, M. K. Ajiriyanto, D. Edbert, E. U. M. Situmorang, D. Nanto, and C. Rosyidan (2023a). Rotating-Magnetic Field-Assisted Electrodeposition of Copper for Ambulance Medical Equipment. Automotive Experiences, 6(2); 290–302.
Syamsuir, S., F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori, and D. Nanto (2023b). Nickel Layers Properties Produced by Electroplating Were Influenced by Spinning Permanent Magnet. Journal of Physics: Conference Series, 2596; 012008.
Tasic, Z. Z., M. B. P. Mihajlovic, M. B. Radovanovic, and M. M. Antonijevic (2018). Electrochemical Investigations of Copper Corrosion Inhibition by Azithromycin in 0.9% NaCl. Journal of Molecular Liquids, 265; 687–692.
Tavakoli, S., M. Kharaziha, and S. Ahmadi (2019). Green Synthesis and Morphology Dependent Antibacterial Activity of Copper Oxide Nanoparticles. Journal of Nanostructures, 9(1); 163–171.
Wang, D., B. Xiang, Y. Liang, S. Song, and C. Liu (2014). Corrosion Control of Copper in 3.5 wt.% NaCl Solution by Domperidone: Experimental and Theoretical Study. Corrosion Science, 85; 77–86.
Wang, H., P. Cheng, H. Wang, R. Liu, L. Sun, Q. Rao, Z. Wang, T. Gu, and G. Ding (2015). Effect of Current Density on Microstructure and Mechanical Property of Cu Micro-Cylinders Electrodeposited in Through Silicon Vias. Materials Characterization, 109; 164–172.
Wang, T. and W. Chen (2015). Effects of Rotating Magnetic Fields on Nickel Electro-Deposition. ECS Electrochemistry Letters, 4(6); D14–D17.
Ye, P., Q. Niu, and F. Wang (2023). Effect of Electrolyte Composition and Deposition Voltage on the Deposition Rate of Copper Microcolumns Jet Electrodeposition. Materials Science and Engineering: B, 298; 116857.
Yonezawa, T., Y. Uchida, and H. Tsukamoto (2015). X-Ray Diffraction and High-Resolution TEM Observations of Biopolymer Nanoskin-Covered Metallic Copper Fine Particles: Preparative Conditions and Surface Oxidation States. Physical Chemistry Chemical Physics, 17(48); 32511–32516.
Aguilar-Perez, D., R. Vargas-Coronado, J. M. Cervantes-Uc, N. Rodriguez-Fuentes, C. Aparicio, C. Covarrubias, M. Alvarez-Perez, V. Garcia-Perez, M. Martinez-Hernandez, and J. V. Cauich-Rodriguez (2020). Antibacterial Activity of a Glass Ionomer Cement Doped with Copper Nanoparticles. Dental Materials Journal, 39(3); 389–396.
Ahamed, M., H. A. Alhadlaq, M. A. M. Khan, P. Karuppiah, and N. A. Al-Dhabi (2014). Synthesis, Characterization, and Antimicrobial Activity of Copper Oxide Nanoparticles. Journal of Nanomaterials, 2014; 637858.
Arendsen, L. P., R. Thakar, and A. H. Sultan (2019). The Use of Copper as an Antimicrobial Agent in Health Care, Including Obstetrics and Gynecology. Clinical Microbiology Reviews, 32(4); 1–28.
Armini, S. (2011). Cu Electrodeposition on Resistive Substrates in Alkaline Chemistry: Effect of Current Density and Wafer RPM. Journal of The Electrochemical Society, 158(6); D390–D394.
Augustin, A., P. Huilgol, K. R. Udupa, and K. U. Bhat (2016a). Effect of Current Density During Electrodeposition on Microstructure and Hardness of Textured Cu Coating in the Application of Antimicrobial Al Touch Surface. Journal of the Mechanical Behavior of Biomedical Materials, 63; 352–360.
Augustin, A., K. R. Udupa, and K. U. Bhat (2016b). Effect of Coating Current Density on the Wettability of Electrodeposited Copper Thin Film on Aluminum Substrate. Perspectives in Science, 8; 472–474.
Chiba, A., T. Ogawa, and T. Yamashita (1988). Magnetic Field Effects on the Electrodeposition of Copper from Copper Sulphate in Sulphuric Acid. Surface and Coatings Technology, 34(4); 455–462.
Ekthammathat, N., T. Thongtem, and S. Thongtem (2013). Antimicrobial Activities of CuO Films Deposited on Cu Foils by Solution Chemistry. Applied Surface Science, 277; 211–217.
Fatimah, I., N. Nurlaela, A. Z. Fauziyyah, S. Sagadevan, H. Hidayat, M. N. M. Haneef, M. F. Daud, A. Kamari, and W. C. Oh (2025). Clitoria Ternatea Flower Extract Mediated Synthesis of Ni-Doped Hydroxyapatite as Photocatalyst, Antibacterial, and Drug Delivery Agent for Anticancer Drug. Science and Technology Indonesia, 10(2); 360–373.
Fatoni, A., A. Rendowati, L. Sirumapea, L. Miranti, S. Masitoh, and N. Hidayati (2023). Synthesis, Characterization of Chitosan-ZnO/CuO Nanoparticles Film, and Its Effect as an Antibacterial Agent of Escherichia coli. Science and Technology Indonesia, 8(3); 373–381.
Fuku, X., M. Modibedi, and M. Mathe (2020). Green Synthesis of Cu/Cu₂O/CuO Nanostructures and the Analysis of Their Electrochemical Properties. SN Applied Sciences, 2(5); 1–15.
Fukunaka, Y., H. Doi, and Y. Kondo (1990). Structural Variation of Electrodeposited Copper Film with the Addition of an Excess Amount of H₂SO₄. Journal of The Electrochemical Society, 137(1); 88–93.
Gilbertson, L. M., E. M. Albalghiti, Z. S. Fishman, F. Perreault, C. Corredor, J. D. Posner, M. Elimelech, L. D. Pfefferle, and J. B. Zimmerman (2016). Shape-Dependent Surface Reactivity and Antimicrobial Activity of Nano-Cupric Oxide. Environmental Science and Technology, 50(7); 3975–3984.
Goranova, D., R. Rashkov, G. Avdeev, and V. Tonchev (2016). Electrodeposition of Ni–Cu Alloys at High Current Densities: Details of the Elements Distribution. Journal of Materials Science, 51(18); 8663–8673.
Grujicic, D. and B. Pesic (2002). Electrodeposition of Copper: The Nucleation Mechanisms. Electrochimica Acta, 47(18); 2901–2912.
Haerifar, M. and M. Zandrahimi (2013). Effect of Current Density and Electrolyte pH on Microstructure of Mn–Cu Electroplated Coatings. Applied Surface Science, 284; 126–132.
Hsu, J., M. S. E. Houache, Y. Abu-Lebdeh, R. A. Patton, M. I. Guzman, and H. A. Al-Abadleh (2024). In Situ Electrochemistry of Formate on Cu Thin Films Using ATR-FTIR Spectroscopy and X-ray Photoelectron Spectroscopy. Langmuir, 40(4); 2377–2384.
Ibañez, A. and E. Fatás (2005). Mechanical and Structural Properties of Electrodeposited Copper and Their Relation with the Electrodeposition Parameters. Surface and Coatings Technology, 191(1); 7–16.
Ji, R., K. Han, H. Jin, X. Li, Y. Liu, S. Liu, T. Dong, B. Cai, and W. Cheng (2020). Preparation of Ni–SiC Nano-Composite Coating by Rotating Magnetic Field-Assisted Electrodeposition. Journal of Manufacturing Processes, 57; 787–797.
Kamila, E. A., Z. Abidin, I. I. Arief, and Trivadila (2023). Synthesis, Characterization, Antibacterial Activity, and Potential Water Filter Application of Copper Oxide/Zeolite Composite. Makara Journal of Science, 27(3); 186–193.
Kayani, Z. N., M. Ashfaq, S. Riaz, and S. Naseem (2022). Impact of Cu on Structural, Optical, Dielectric Properties and Antibacterial Activity of TiO₂ Thin Films. Optical Materials, 132; 112809.
Kong, Q., A. Zeng, M. Chen, M. Zhou, and Q. Xu (2003). Infrared Spectra and Density Functional Calculations of the Copper Thiocarbonyls: CuCS, Cu(CS)₂, and Cu₂CS in Solid Argon. Journal of Chemical Physics, 118(16); 7267–7272.
Larson, A. C. and R. B. V. Dreele (2004). General Structure Analysis System (GSAS). Technical Report Vol. 748, Los Alamos.
Li, W., L. Hu, S. Zhang, and B. Hou (2011). Effects of Two Fungicides on the Corrosion Resistance of Copper in 3.5% NaCl Solution Under Various Conditions. Corrosion Science, 53(2); 735–745.
Li, Z., B. Tan, J. Luo, J. Qin, G. Yang, C. Cui, and L. Pan (2022). Structural Influence of Nitrogen-Containing Groups on Triphenylmethane-Based Levelers in Super-Conformal Copper Electroplating. Electrochimica Acta, 401; 139445.
Liu, Y., B. Zheng, T. Zhang, Y. Chen, J. Liu, Z. Wang, and X. Gong (2022). Magnetic Field Intensified Electrodeposition of Low-Concentration Copper Ions in Aqueous Solution. Electrochimica Acta, 432; 141201.
Mogi, I., R. Morimoto, R. Aogaki, and K. Watanabe (2013). Surface Chirality Induced by Rotational Electrodeposition in Magnetic Fields. Scientific Reports, 3; 2574.
Morimoto, R., A. Sugiyama, and R. Aogaki (2004). Nano-Scale Crystal Formation in Copper Magneto-Electrodeposition Under Parallel Magnetic Fields. Electrochemistry, 72(6); 421–423.
Motshekga, S. C. (2024). Structural and Antibacterial Properties of Copper Oxide Nanoparticles: A Study on the Effect of Calcination Temperature. Nano Express, 5(1); 015011.
Murdoch, H. A., D. Yin, E. Hernández-Rivera, and A. K. Giri (2018). Effect of Applied Magnetic Field on Microstructure of Electrodeposited Copper. Electrochemistry Communications, 97; 11–15.
Niu, J., X. Liu, K. Xia, L. Xu, Y. Xu, X. Fang, and W. Lu (2015). Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams. International Journal of Electrochemical Science, 10(9); 7331–7340.
Park, B. N., Y. S. Sohn, and S. Y. Choi (2008). Effects of a Magnetic Field on the Copper Metallization Using the Electroplating Process. Microelectronic Engineering, 85(2); 308–314.
Raja, F. N. S., T. Worthington, and R. A. Martin (2023). The Antimicrobial Efficacy of Copper, Cobalt, Zinc and Silver Nanoparticles: Alone and in Combination. Biomedical Materials (Bristol), 18; 045003.
Ramyadevi, J., K. Jeyasubramanian, A. Marikani, G. Rajakumar, and A. A. Rahuman (2012). Synthesis and Antimicrobial Activity of Copper Nanoparticles. Materials Letters, 71; 114–116.
Salah, I., E. Allan, S. P. Nair, and I. P. Parkin (2024). Antibacterial Performance of a Copper Nanoparticle Thin Film. Nano Select, 5(9); 1–13.
SEAKR, R. (2017). Microstructure and Crystallographic Characteristics of Nanocrystalline Copper Prepared from Acetate Solutions by Electrodeposition Technique. Transactions of Nonferrous Metals Society of China (English Edition), 27(6); 1423–1430.
SEKAR, R. (2017). Synergistic Effect of Additives on Electrodeposition of Copper from Cyanide-Free Electrolytes and Its Structural and Morphological Characteristics. Transactions of Nonferrous Metals Society of China (English Edition), 27(7); 1665–1676.
Selvaraj, S. P. (2020). Enhanced Surface Morphology of Copper Oxide (CuO) Nanoparticles and Its Antibacterial Activities. Materials Today: Proceedings, 50; 2865–2868.
Sen, P., J. Ghosh, A. Abdullah, P. Kumar, and Vandana (2003). Preparation of Cu, Ag, Fe and Al Nanoparticles by the Exploding Wire Technique. Journal of Chemical Sciences, 115; 499–508.
Sharifahmadian, O., H. R. Salimijazi, M. H. Fathi, J. Mostaghimi, and L. Pershin (2013). Relationship Between Surface Properties and Antibacterial Behavior of Wire Arc Spray Copper Coatings. Surface and Coatings Technology, 233; 74–79.
Shim, G. I., S. H. Kim, H. W. Eom, and S. Y. Choi (2015). Concentration and Roughness-Dependent Antibacterial and Antifungal Activities of CuO Thin Films and Their Cu Ion Cytotoxicity and Elution Behavior. Journal of Industrial Microbiology and Biotechnology, 42(5); 735–744.
Sudheer and M. A. Quraishi (2013). Electrochemical and Theoretical Investigation of Triazole Derivatives on Corrosion Inhibition Behavior of Copper in Hydrochloric Acid Medium. Corrosion Science, 70; 161–169.
Syamsuir, R. S. Kusumah, A. Premono, A. Lubi, B. Soegijono, S. D. Yudanto, M. K. Ajiriyanto, S. Ismarwanti, R. Kriswarini, C. Rosyidan, D. Nanto, Basori, and F. B. Susetyo (2024). Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers. E-Journal of Surface Science and Nanotechnology, 22(2); 120–128.
Syamsuir, F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori, M. K. Ajiriyanto, D. Edbert, E. U. M. Situmorang, D. Nanto, and C. Rosyidan (2023a). Rotating-Magnetic Field-Assisted Electrodeposition of Copper for Ambulance Medical Equipment. Automotive Experiences, 6(2); 290–302.
Syamsuir, S., F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori, and D. Nanto (2023b). Nickel Layers Properties Produced by Electroplating Were Influenced by Spinning Permanent Magnet. Journal of Physics: Conference Series, 2596; 012008.
Tasic, Z. Z., M. B. P. Mihajlovic, M. B. Radovanovic, and M. M. Antonijevic (2018). Electrochemical Investigations of Copper Corrosion Inhibition by Azithromycin in 0.9% NaCl. Journal of Molecular Liquids, 265; 687–692.
Tavakoli, S., M. Kharaziha, and S. Ahmadi (2019). Green Synthesis and Morphology Dependent Antibacterial Activity of Copper Oxide Nanoparticles. Journal of Nanostructures, 9(1); 163–171.
Wang, D., B. Xiang, Y. Liang, S. Song, and C. Liu (2014). Corrosion Control of Copper in 3.5 wt.% NaCl Solution by Domperidone: Experimental and Theoretical Study. Corrosion Science, 85; 77–86.
Wang, H., P. Cheng, H. Wang, R. Liu, L. Sun, Q. Rao, Z. Wang, T. Gu, and G. Ding (2015). Effect of Current Density on Microstructure and Mechanical Property of Cu Micro-Cylinders Electrodeposited in Through Silicon Vias. Materials Characterization, 109; 164–172.
Wang, T. and W. Chen (2015). Effects of Rotating Magnetic Fields on Nickel Electro-Deposition. ECS Electrochemistry Letters, 4(6); D14–D17.
Ye, P., Q. Niu, and F. Wang (2023). Effect of Electrolyte Composition and Deposition Voltage on the Deposition Rate of Copper Microcolumns Jet Electrodeposition. Materials Science and Engineering: B, 298; 116857.
Yonezawa, T., Y. Uchida, and H. Tsukamoto (2015). X-Ray Diffraction and High-Resolution TEM Observations of Biopolymer Nanoskin-Covered Metallic Copper Fine Particles: Preparative Conditions and Surface Oxidation States. Physical Chemistry Chemical Physics, 17(48); 32511–32516.
Authors
Susetyo, F. B., Basori, Mansor, M. R. ., Ruliyanta, Yudanto, S. D. ., Rosyidan, C. ., Situmorang, E. U. M. ., Edbert, D. ., Mutiara, E. ., Yulianto, T. ., Agus Jamaludin, & Nanto, D. . (2025). Cu Film Characteristics Synthesized Using Electrodeposition Technique at Various Currents and Under a Rotating Neodymium Magnet. Science and Technology Indonesia, 10(4), 1156–1168. https://doi.org/10.26554/sti.2025.10.4.1156-1168
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